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Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options (Springer Series in Advanced Microelectronics) Book
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.Read More
from£89.96 | RRP: * Excludes Voucher Code Discount Also available Used from £98.85
- 0387281533
- 9780387281537
- William Greig
- 16 May 2007
- Springer
- Hardcover (Book)
- 300
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