Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options (Springer Series in Advanced Microelectronics) Book + PRICE WATCH * Amazon pricing is not included in price watch

Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options (Springer Series in Advanced Microelectronics) Book

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.Read More

from£89.96 | RRP: £81.00
* Excludes Voucher Code Discount Also available Used from £98.85
  • 0387281533
  • 9780387281537
  • William Greig
  • 16 May 2007
  • Springer
  • Hardcover (Book)
  • 300
As an Amazon Associate we earn from qualifying purchases. If you click through any of the links below and make a purchase we may earn a small commission (at no extra cost to you). Click here to learn more.

Would you like your name to appear with the review?

We will post your book review within a day or so as long as it meets our guidelines and terms and conditions. All reviews submitted become the licensed property of www.find-book.co.uk as written in our terms and conditions. None of your personal details will be passed on to any other third party.

All form fields are required.