Solder Joint Reliability Prediction for Multiple Environments Book + PRICE WATCH * Amazon pricing is not included in price watch

Solder Joint Reliability Prediction for Multiple Environments Book

Here is a text that will provide industry engineers graduate students academic researchers and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.Read More

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  • Pickabook

    Andrew Eugene Perkins, Suresh K. Sitaraman

  • 0387793933
  • 9780387793931
  • Andrew E. Perkins, Suresh K. Sitaraman
  • 28 November 2008
  • Springer
  • Hardcover (Book)
  • 192
  • illustrated edition
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