Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies (Electronic Packaging & Interconnection Series) Book + PRICE WATCH * Amazon pricing is not included in price watch

Solder Joint Reliability of BGA, CSP and Flip Chip Assemblies (Electronic Packaging & Interconnection Series) Book

This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.Read More

from£N/A | RRP: £39.99
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  • 0070366489
  • 9780070366480
  • John H. Lau, Yi-Hsin Pao
  • 1 September 1996
  • McGraw-Hill Inc.,US
  • Hardcover (Book)
  • 408
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